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UBC Theses and Dissertations
The influence of additives on microstructure evolution of electrochemically deposited copper films Gao, Jie
Abstract
This thesis presents an investigation of the effects of additives on kinetics of deposition and microstructure evolution of Cu films, which were electrochemically deposited (ECD) on Au substrates. The rate of bulk Cu deposition was quantified with cyclic voltammetry. The self-annealing of the as-deposited Cu films was recorded at room temperature with resistivity measurements. Furthermore, the grain size evolution during self-annealing was characterized by X-ray diffraction. The challenges associated with these measurements such as reproducibility tests, the effects of substrate quality, and the aging of chemicals is discussed in detail. A systematic error of resistivity measurements is reduced to 3% by correcting the resistivities value. Considering the sensitivity in the measurement of initial absolute resistivity, it is suggested to use the normalized resistivity for presenting the results. XRD technique is a good way for estimating the microstructure evolution during self-annealing. However, the use of resistivity techniques is recommended to investigate self-annealing kinetics. The additives, PEG and SPS play an important role in influencing the deposition rate and self-annealing rate, whereas, the effect in JGB also cannot be neglected especially its influence during underpotential deposition (UPD) stage and on the rate of self-annealing. A suitable selection of the type and the concentration in additives will be the key to control the kinetics of deposition and self-annealing in order to match the requirements of Cu interconnects.
Item Metadata
Title |
The influence of additives on microstructure evolution of electrochemically deposited copper films
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Creator | |
Publisher |
University of British Columbia
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Date Issued |
2003
|
Description |
This thesis presents an investigation of the effects of additives on kinetics of deposition
and microstructure evolution of Cu films, which were electrochemically deposited (ECD)
on Au substrates. The rate of bulk Cu deposition was quantified with cyclic voltammetry.
The self-annealing of the as-deposited Cu films was recorded at room temperature with
resistivity measurements. Furthermore, the grain size evolution during self-annealing was
characterized by X-ray diffraction. The challenges associated with these measurements
such as reproducibility tests, the effects of substrate quality, and the aging of chemicals is
discussed in detail. A systematic error of resistivity measurements is reduced to 3% by
correcting the resistivities value. Considering the sensitivity in the measurement of initial
absolute resistivity, it is suggested to use the normalized resistivity for presenting the
results.
XRD technique is a good way for estimating the microstructure evolution during self-annealing.
However, the use of resistivity techniques is recommended to investigate self-annealing
kinetics. The additives, PEG and SPS play an important role in influencing the
deposition rate and self-annealing rate, whereas, the effect in JGB also cannot be
neglected especially its influence during underpotential deposition (UPD) stage and on
the rate of self-annealing. A suitable selection of the type and the concentration in
additives will be the key to control the kinetics of deposition and self-annealing in order
to match the requirements of Cu interconnects.
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Extent |
7194941 bytes
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Genre | |
Type | |
File Format |
application/pdf
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Language |
eng
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Date Available |
2009-11-17
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Provider |
Vancouver : University of British Columbia Library
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Rights |
For non-commercial purposes only, such as research, private study and education. Additional conditions apply, see Terms of Use https://open.library.ubc.ca/terms_of_use.
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DOI |
10.14288/1.0079153
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URI | |
Degree | |
Program | |
Affiliation | |
Degree Grantor |
University of British Columbia
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Graduation Date |
2003-11
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Campus | |
Scholarly Level |
Graduate
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Aggregated Source Repository |
DSpace
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Item Media
Item Citations and Data
Rights
For non-commercial purposes only, such as research, private study and education. Additional conditions apply, see Terms of Use https://open.library.ubc.ca/terms_of_use.