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Vacuum packaging of microresonators by rapid thermal processing

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Title: Vacuum packaging of microresonators by rapid thermal processing
Author: Chiao, Mu; Lin, Liwei
Issue Date: 2002
Publicly Available in cIRcle 2011-11-09
Publisher Society of Photo-Optical Instrumentation Engineers
Citation: Mu Chiao and Liwei Lin, "Vacuum packaging of microresonators by rapid thermal processing", Proc. SPIE 4700, 274 (2002); doi:10.1117/12.475039
Abstract: Vacuum packaging of micro resonators using TRP aluminum-to- nitride bonding has been demonstrated. Polysilicon micro resonators are fabricated with integrated sealing rings using surface micromachining technology. The top most layer on the sealing ring is silicon nitride. Aluminum sealing rings are patterned on the Pyrex glass cap wafers. The bonding and sealing of device wafer to cap wafer is done by heating the wafers in the RTP chamber at 750 degrees C for 10 seconds in vacuum. The quality factor of a vacuum- packaged micro resonator is measured as 400 +/- 50. Copyright 2002 Society of Photo-Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
Affiliation: Mechanical Engineering, Dept of
URI: http://hdl.handle.net/2429/38903
Peer Review Status: Reviewed
Scholarly Level: Faculty

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