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Evaporative cooling in the contact line region Stefurak, Glenn
Abstract
Evaporative cooling of small, high power dissipating devices using thin liquid films is becoming an increasingly important field of research as the requirements for this tech- nology grow. Understanding the mechanisms which cause liquid motion in the film and evaporation from the liquid surface is essential to the practical designer attempting to create a truly effective cooling scheme. For liquid films of less than 1 μm, previous experiments have confirmed the existence of an adsorbed layer where no evaporation occurs, plus a region of slightly increased thickness where limited evaporation takes place. A theory has been proposed for the non-evaporating region which modifies the thin liquid film pressure due to the molecular attraction of the underlying substrate. The pressure adjustment is termed the disjoining pressure and is thought to be the dominant driving force for liquid motion in this thin film region In order to test the validity of the disjoining pressure concept for an evaporating film, an experiment was designed which uses a dielectric liquid, FC-72, and a highly polished silicon substrate inclined at a 5° angle from the horizontal to create an extended meniscus. A fluorescent light was used in an interferometer to provide increased film profile data and a specially designed focusing ellipsometer was used to measure film thicknesses in the adsorbed film region. Heat was supplied to the meniscus through a 400 μm wide boron diffused heater within the silicon substrate. Surface temperature and mass evaporation rates were also measured. It was concluded from the results that the disjoining pressure model which had orig- inally been developed for static non-evaporating thin films is equally applicable to evap- orating thin film environments. The model proposes an inverse cubic relationship (1/h 3) between the disjoining pressure and the adsorbed thickness. However, values of the Hamaker constant used in the relationship, inferred from the experiments were 4-5 times the theoretical value. The corresponding heat and mass transfer models which employ the disjoining pres- sure require further study, as evidenced by their prediction of total heat and mass trans- fer rates at least one order of magnitude lower than those measured in the experiments. Improvement of the heater design and of the thin film profiling method are two very important areas to be considered for future work in this field.
Item Metadata
Title |
Evaporative cooling in the contact line region
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Creator | |
Publisher |
University of British Columbia
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Date Issued |
1995
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Description |
Evaporative cooling of small, high power dissipating devices using thin liquid films is
becoming an increasingly important field of research as the requirements for this tech-
nology grow. Understanding the mechanisms which cause liquid motion in the film and
evaporation from the liquid surface is essential to the practical designer attempting to
create a truly effective cooling scheme.
For liquid films of less than 1 μm, previous experiments have confirmed the existence
of an adsorbed layer where no evaporation occurs, plus a region of slightly increased
thickness where limited evaporation takes place. A theory has been proposed for the
non-evaporating region which modifies the thin liquid film pressure due to the molecular
attraction of the underlying substrate. The pressure adjustment is termed the disjoining
pressure and is thought to be the dominant driving force for liquid motion in this thin
film region
In order to test the validity of the disjoining pressure concept for an evaporating film,
an experiment was designed which uses a dielectric liquid, FC-72, and a highly polished
silicon substrate inclined at a 5° angle from the horizontal to create an extended meniscus.
A fluorescent light was used in an interferometer to provide increased film profile data
and a specially designed focusing ellipsometer was used to measure film thicknesses in the
adsorbed film region. Heat was supplied to the meniscus through a 400 μm wide boron
diffused heater within the silicon substrate. Surface temperature and mass evaporation
rates were also measured.
It was concluded from the results that the disjoining pressure model which had orig-
inally been developed for static non-evaporating thin films is equally applicable to evap-
orating thin film environments. The model proposes an inverse cubic relationship (1/h 3)
between the disjoining pressure and the adsorbed thickness. However, values of the
Hamaker constant used in the relationship, inferred from the experiments were 4-5 times
the theoretical value.
The corresponding heat and mass transfer models which employ the disjoining pres-
sure require further study, as evidenced by their prediction of total heat and mass trans-
fer rates at least one order of magnitude lower than those measured in the experiments.
Improvement of the heater design and of the thin film profiling method are two very
important areas to be considered for future work in this field.
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Extent |
3914099 bytes
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Genre | |
Type | |
File Format |
application/pdf
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Language |
eng
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Date Available |
2009-06-11
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Provider |
Vancouver : University of British Columbia Library
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Rights |
For non-commercial purposes only, such as research, private study and education. Additional conditions apply, see Terms of Use https://open.library.ubc.ca/terms_of_use.
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DOI |
10.14288/1.0080820
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URI | |
Degree | |
Program | |
Affiliation | |
Degree Grantor |
University of British Columbia
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Graduation Date |
1995-05
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Campus | |
Scholarly Level |
Graduate
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Aggregated Source Repository |
DSpace
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Item Media
Item Citations and Data
Rights
For non-commercial purposes only, such as research, private study and education. Additional conditions apply, see Terms of Use https://open.library.ubc.ca/terms_of_use.